3M Scotch-Weld Epoxy Potting Compound DP270(pc)

3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is a two-part epoxy material developed for protecting and securing electrical and electronic assemblies. Its low-viscosity formulation helps the compound flow into suitable spaces around components, making it useful for potting work as well as bonding applications.

The cured material forms a rigid structure with low shrinkage, helping maintain the position of enclosed components. Its formulation generates relatively little heat during curing and is non-corrosive to copper, making it suitable for applications involving copper conductors and electrical parts.

Key Features

• Low-viscosity consistency for convenient dispensing and filling.
• Rigid finish after curing.
• Non-corrosive to copper.
• Low shrinkage during the curing process.
• Minimal heat generation during curing.
• Approximately 60–70 minutes of working time, depending on the stated product property.
• Listed shear strength of 2,500 psi at 22°C.
• UL 94 HB flammability classification.

Applications

• Potting electrical components.
• Encapsulating suitable electronic assemblies.
• Securing components within electrical equipment.
• Bonding parts in electronic manufacturing.
• Filling suitable spaces around components for added support.
• Assembly work where a rigid epoxy compound is required.
• Suitable Materials
• Copper components and conductors.
• Compatible electrical and electronic parts.

Why Choose Us?

• Industrial adhesive and potting solutions for different applications.
• Support in selecting products for electrical and electronic assembly.
• Customization available based on application and size requirements.
• New products and solutions are regularly added to our product range.