Tesa 8854 double sided translucent non-woven tape(roll)

tesa 8854 is a 100-micron double-sided translucent non-woven tape consisting of a non-woven backing and a tackified acrylic adhesive, engineered for high-adhesion bonding across foam, plastic, and metal surfaces. This double-sided tape is particularly valued in electronics manufacturing for flexible printed circuit (FPC) mounting and similarly demanding assembly applications.

Key Features

tesa 8854's tackified acrylic adhesive system delivers excellent high-temperature resistance, with the tape rated for use up to 260°C — a critical property for FPC mounting applications that must survive solder reflow processes without losing bond integrity. The temperature-resistant glassine liner ensures the tape releases easily without leaving adhesive residue, even after exposure to reflow soldering temperatures. The highly conformable non-woven backing offers excellent converting performance with limited edge picking during die-cutting, making tesa 8854 a preferred choice for precision die-cut parts in electronics assembly.

Performance Data

tesa 8854 delivers very good adhesion on polar substrates including ABS, polycarbonate, and steel, alongside very good resistance to UV exposure, humidity, and a broad range of chemicals — ensuring long-term durability in demanding environments. The tape's high adhesion level extends across various foam, plastic, and metal surfaces, supporting reliable bonding in mixed-material assemblies common in modern electronic devices.

Applications

tesa 8854 double-sided non-woven tape is widely used for FPC (flexible printed circuit) mounting and assembly of components into electronic devices, mounting nameplates, and lamination of foam and felt materials. Its combination of high-temperature resistance and reliable adhesion on polar substrates makes it especially valuable in electronics manufacturing where components must withstand reflow soldering without bond failure.

Directions for Use

Clean and dry the surfaces to be bonded before application. Apply tesa 8854 evenly to the first substrate, removing air bubbles by pressing firmly from center outward. Remove the temperature-resistant glassine liner and bond the second surface, applying firm pressure for optimal adhesion. For die-cut applications, the tape's non-woven backing supports clean, precise converting with minimal edge fraying.

Why Buy From Tapemart

Tapemart supplies genuine tesa 8854 double-sided translucent non-woven tape for electronics assembly, FPC mounting, and general industrial bonding applications. As an authorized tesa distributor, we stock the complete range of tesa non-woven double-sided tapes for every temperature and substrate requirement. Order tesa 8854 from Tapemart for high-temperature-resistant bonding that survives reflow soldering without residue.